product smallclass 1

  • C4004 B1717
  • C4004 B1717
C4004 B1717C4004 B1717

C4004 B1717

  • length:3.00cm
  • width:1.00cm
  • height:0.75cm
  • Product description:
  • INQUIRY
  • Features
    • Low-cost, low-power FPGA fabric
    • 1.0V and 1.2V core voltage options 
    • Available in commercial, industrial, and automotive temperature grades
    • Several package types and footprints: 
    • FineLine BGA (FBGA)
    • Enhanced Thin Quad Flat Pack (EQFP) 
    • Ultra FineLine BGA (UBGA)
    • Micro FineLine BGA (MBGA)
    • Multiple device densities with pin migration capability
    • RoHS6 compliance

    • Logic elements — four-input look-up table (LUT) and register
    • Abundant routing/metal interconnect between all LEs
    • M9K — 9 kilobits (Kb) of embedded SRAM memory blocks, cascadable

    Applications
    • I/O expansion
    • Interfacing
    • Bridging
    • Sensor fusion
    • Industrial motor control

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