Surface-mount packages range in size from small to minuscule. They are all designed to sit on one side of a circuit board and be soldered to the surface. The pins of a SMD package either extrude out the side, perpendicular to the chip, or are sometimes arranged in a matrix on the bottom of the chip. ICs in this form factor are not very “hand-assembly-friendly.” They usually require special tools to aid in the process.
Contact: Pierce
Phone: +86 13826506145
Tel: +86 0755-29096216
Email: sales@bsytech.com
Add: No. 20, 1st Floor, Shangshangju, Shasi Town, Shajing Town, Bao'an District, Shenzhen, China